Product Description

DB291

This product is a single component, low temperature fast heat curing  modified epoxy resin adhesive. Excellent adhesion between many different  types of materials at lower temperatures and in a very short time. The  product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used  for bonding heat-sensitive components,suitable for memory cards,  CCD/CMOS, LED backlights etc.

Payment Terms︰ TT

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