Product Description

DB118

This product is a one-component epoxy resin adhesive with high thermal  conductivity, which is the best matching adhesive for thermal bonding of  chips. Applicable to all kinds of electronic products, characterized by rapid  thermal curing, and easy to apply. Upon cure, it has high bonding strength,  good thermal conductivity, low shrinkage, low moisture absorption, good  insulation performance, etc., which can reduce the working temperature of the  chip, extend the life of the chip

Payment Terms︰ TT

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